The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Dec. 02, 2013
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H02K 11/00 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H02K 3/52 (2006.01); H02K 11/02 (2006.01); H02K 9/22 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02K 11/0094 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/30105 (2013.01); H02K 3/522 (2013.01); H02K 11/0073 (2013.01); H02K 11/024 (2013.01); H02K 2211/03 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01068 (2013.01); H02K 9/22 (2013.01); H01L 2924/1306 (2013.01);
Abstract
A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.