The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Mar. 13, 2012
Applicants:

Christopher James Kapusta, Delanson, NY (US);

James Sabatini, Scotia, NY (US);

Inventors:

Christopher James Kapusta, Delanson, NY (US);

James Sabatini, Scotia, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/18 (2013.01); H01L 24/82 (2013.01); H01L 25/105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/014 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01);
Abstract

An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.


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