The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Jun. 30, 2010
Ryosuke Usui, Ichinomiya, JP;
Yusuke Igarashi, Isesaki, JP;
Yasunori Inoue, Ogaki, JP;
Mayumi Nakasato, Ogaki, JP;
Masayuki Nagamatsu, Mizuho, JP;
Yasuhiro Kohara, Hashima, JP;
Ryosuke Usui, Ichinomiya, JP;
Yusuke Igarashi, Isesaki, JP;
Yasunori Inoue, Ogaki, JP;
Mayumi Nakasato, Ogaki, JP;
Masayuki Nagamatsu, Mizuho, JP;
Yasuhiro Kohara, Hashima, JP;
Abstract
Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics.