The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Sep. 14, 2012
Applicants:
IN Chul Hwang, Icheon-si, KR;
IL Hwan Cho, Icheon-si, KR;
Ki Young Kim, Seongnam-si, KR;
Inventors:
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2224/11001 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/1607 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/13011 (2013.01); H05K 3/3436 (2013.01); H05K 3/4007 (2013.01); H05K 2201/0367 (2013.01); H05K 2203/308 (2013.01); H01L 2224/16225 (2013.01);
Abstract
Substrates and semiconductor chips are provided. The substrate or the semiconductor chip includes a body and a substantially pillar-shaped bump disposed on a first surface of the body. The pillar-shaped bump has a hole penetrating a portion thereof. Related semiconductor packages are also provided. Further, related methods are provided.