The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
May. 02, 2012
Applicants:
Yunhyeok Im, Hwaseong-si, KR;
Kyol Park, Daejeon, KR;
Taeje Cho, Hwaseong-si, KR;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/12 (2006.01); H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/31 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/3128 (2013.01); H01L 23/427 (2013.01); H01L 23/4275 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Semiconductor package are provided. In one embodiment, the semiconductor package may include a substrate such as a circuit substrate, a semiconductor chip mounted on the circuit substrate, a molding (or an encapsulant) covering the semiconductor chip and the circuit substrate and including a first temperature control member, and a heat dissipation member covering the molding.