The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Oct. 08, 2013
Applicant:

Kundae Yeom, Cheonan-si, KR;

Inventor:

Kundae Yeom, Cheonan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 21/44 (2006.01); H01L 23/50 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/107 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01);
Abstract

Disclosed are semiconductor devices and methods of manufacturing the same. The semiconductor device includes an interposer and a first semiconductor package comprising a first substrate, and a first semiconductor chip mounted on the first substrate. The device also includes at least two second semiconductor packages electrically connected to a top surface of the interposer, the second semiconductor packages spaced apart from each other in a direction parallel to the top surface of the interposer. Each of the second semiconductor packages comprises a second substrate, a second semiconductor chip mounted on the second substrate and a mold part disposed on the second substrate to protect the second semiconductor chip.


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