The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Mar. 13, 2013
Applicant:
Hangzhou Haicun Information Technology Co., Ltd., HangZhou, CN;
Inventor:
Guobiao Zhang, Corvallis, OR (US);
Assignees:
HangZhou HaiCun Information Technology Co., Ltd., HangZhou, ZheJiang, CN;
Guobiao Zhang, Covallis, OR (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); G11C 5/02 (2006.01); H01L 27/06 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/18 (2006.01); H01L 27/10 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
G11C 5/02 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 27/0688 (2013.01); H01L 27/101 (2013.01); G11C 13/0004 (2013.01); G11C 13/0007 (2013.01); G11C 13/0011 (2013.01); G11C 13/0038 (2013.01); G11C 2213/71 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/107 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01);
Abstract
The present invention discloses a discrete three-dimensional memory (3D-M). It comprises at least a 3D-array die and at least an integrated intermediate-circuit die comprising both a read/write-voltage generator (V/V-generator) and an address/data translator (A/D-translator). The intermediate-circuit die performs voltage, address and/or data conversion between the 3D-M core region and the host. Discrete 3D-M support multiple 3D-array dies.