The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Oct. 01, 2013
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventors:

Hiroyuki Katayama, Osaka, JP;

Takashi Kondo, Osaka, JP;

Yuki Ebe, Osaka, JP;

Munehisa Mitani, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 33/502 (2013.01); H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 2933/005 (2013.01); H01L 21/56 (2013.01); H01L 33/005 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 21/6835 (2013.01); H01L 24/81 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/12041 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01);
Abstract

An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.


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