The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Mar. 28, 2012
Applicants:

Der-wei Tu, Taipei, TW;

Wei-chih Wen, Hsinchu, TW;

Tai-chun Wang, Changhua County, TW;

Po-hung Lai, Taichung, TW;

Chih-ping Hsu, Changhua County, TW;

Inventors:

Der-Wei Tu, Taipei, TW;

Wei-Chih Wen, Hsinchu, TW;

Tai-Chun Wang, Changhua County, TW;

Po-Hung Lai, Taichung, TW;

Chih-Ping Hsu, Changhua County, TW;

Assignee:

Huga Optotech Inc., Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A semiconductor light-emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a light-emitting layer, an electrode, an insulating layer, and an adhesive layer is provided. The light-emitting layer is disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer. The electrode is disposed on the first conductive type semiconductor layer. The insulating layer covers a part of the first conductive type semiconductor layer and the electrode. The adhesive layer is disposed between the electrode and the insulating layer so as to bond the electrode and the insulating layer.


Find Patent Forward Citations

Loading…