The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Oct. 02, 2012
Applicant:

Andrew Llc, Hickory, NC (US);

Inventors:

Jeffrey D Paynter, Momence, IL (US);

Kendrick Van Swearingen, Woodridge, IL (US);

James J Carlock, Homer Glen, IL (US);

James P Fleming, Orland Park, IL (US);

Assignee:

CommScope Technologies LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 15/02 (2006.01); H01R 13/58 (2006.01); B29C 45/14 (2006.01); H01R 9/05 (2006.01); B29L 31/34 (2006.01); H01R 4/02 (2006.01); H01R 24/56 (2011.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5845 (2013.01); B29L 2031/3462 (2013.01); B29C 45/14598 (2013.01); H01R 4/028 (2013.01); H01R 24/564 (2013.01); B29L 2031/707 (2013.01); B29C 45/14311 (2013.01); B29C 45/14491 (2013.01); B29C 45/14549 (2013.01); B29C 45/14639 (2013.01); H01R 9/05 (2013.01);
Abstract

A strain relief for a coaxial cable and coaxial connector interconnection is provided as an injection moldable polymer material surrounding the interconnection. The injection moldable material fills a solder pre-form cavity between an outer conductor of the coaxial cable and an inner diameter of a bore of the connector body. Where the outer conductor is corrugated, the polymer material may be provided covering an exposed portion of the corrugations and/or filling portions of a corrugation trough between an outer jacket and the outer diameter of the outer conductor.


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