The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Nov. 09, 2011
Applicants:

Shinji Watanabe, Kyoto, JP;

Yasuhiro Tsudo, Kyoto, JP;

Masaki Inaba, Kyoto, JP;

Jun Takeuchi, Kyoto, JP;

Yuko Matsumoto, Kyoto, JP;

Inventors:

Shinji Watanabe, Kyoto, JP;

Yasuhiro Tsudo, Kyoto, JP;

Masaki Inaba, Kyoto, JP;

Jun Takeuchi, Kyoto, JP;

Yuko Matsumoto, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/83 (2006.01); C08G 18/42 (2006.01); C08K 5/092 (2006.01); C08K 5/103 (2006.01); C08G 18/80 (2006.01); C08G 18/32 (2006.01); C08L 75/06 (2006.01); B29C 41/00 (2006.01); B29C 41/18 (2006.01); C08G 18/66 (2006.01); C08G 18/73 (2006.01); C08G 18/12 (2006.01); C08G 18/28 (2006.01); C08G 18/34 (2006.01); C08K 5/04 (2006.01); C08L 75/12 (2006.01); B29K 75/00 (2006.01);
U.S. Cl.
CPC ...
C08G 18/831 (2013.01); C08G 18/42 (2013.01); C08G 18/4208 (2013.01); C08K 5/092 (2013.01); C08K 5/103 (2013.01); C08G 18/8064 (2013.01); C08G 18/3215 (2013.01); C08L 75/06 (2013.01); B29C 41/003 (2013.01); B29C 41/18 (2013.01); B29K 2075/00 (2013.01); C08G 18/6659 (2013.01); C08G 18/73 (2013.01); C08G 18/12 (2013.01); C08G 18/2825 (2013.01); C08G 18/345 (2013.01); C08G 18/4202 (2013.01); C08G 2140/00 (2013.01); C08K 5/04 (2013.01); C08L 75/12 (2013.01);
Abstract

Provided is a slush molding material which exhibits excellent low-temperature meltability and heat resistance and which can yield a molded product having excellent tensile strength and elongation. The present invention is urethane resin particles (D) comprising a urethane or urethane-urea resin (U) that has residues (j) bonded thereto covalently, said residues (j) being residues derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, or urethane resin particles (D) comprising a urethane resin composition (S) which comprises both a urethane or urethane-urea resin (U) and a compound (E) that has a residue (j) derived from an at least trivalent aromatic polycarboxylic acid by removing hydroxyl groups, said compound (E) being represented by general formula (1), wherein the residues (j) are linked respectively to urethane or urea groups (u) of the resin (U) or (U) by hydrogen bonds.


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