The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Nov. 23, 2011
Applicants:

Chantal Arena, Mesa, AZ (US);

Ronald Thomas Bertram, Mesa, AZ (US);

Ed Lindow, Cornville, AZ (US);

Inventors:

Chantal Arena, Mesa, AZ (US);

Ronald Thomas Bertram, Mesa, AZ (US);

Ed Lindow, Cornville, AZ (US);

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/36 (2006.01); H01L 21/02 (2006.01); C23C 16/02 (2006.01); C23C 16/30 (2006.01); C30B 25/02 (2006.01); C30B 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0254 (2013.01); H01L 21/0242 (2013.01); H01L 21/02439 (2013.01); H01L 21/02458 (2013.01); H01L 21/0262 (2013.01); C23C 16/0272 (2013.01); C23C 16/303 (2013.01); C30B 25/02 (2013.01); C30B 29/403 (2013.01);
Abstract

Bulk III-nitride semiconductor materials are deposited in an HPVE process using a metal trichloride precursor on a metal nitride template layer of a growth substrate. Deposition of the bulk III-nitride semiconductor material may be performed without ex situ formation of the template layer using a MOCVD process. In some embodiments, a nucleation template layer is formed ex situ using a non-MOCVD process prior to depositing bulk III-nitride semiconductor material on the template layer using an HVPE process. In additional embodiments, a nucleation template layer is formed in situ using an MOCVD process prior to depositing bulk III-nitride semiconductor material on the template layer using an HVPE process. In further embodiments, a nucleation template layer is formed in situ using an HVPE process prior to depositing bulk III-nitride semiconductor material on the template layer using an HVPE process.


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