The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Mar. 11, 2011
Applicants:

Kyotaro Goto, Tokyo, JP;

Naoto Hagiwara, Tokyo, JP;

Yuki Kawai, Tokyo, JP;

Katsuei Ishida, Tokyo, JP;

Inventors:

Kyotaro Goto, Tokyo, JP;

Naoto Hagiwara, Tokyo, JP;

Yuki Kawai, Tokyo, JP;

Katsuei Ishida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); H01G 11/22 (2013.01); H01G 11/08 (2013.01); H01G 11/78 (2013.01); H01M 2/06 (2006.01); H01M 2/10 (2006.01); H01M 10/04 (2006.01); H01G 11/82 (2013.01); H01M 2/22 (2006.01); H01M 10/0525 (2010.01); H01M 10/0583 (2010.01); H01M 10/42 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0277 (2013.01); H01G 11/08 (2013.01); H01G 11/78 (2013.01); H01M 2/021 (2013.01); H01M 2/0212 (2013.01); H01M 2/06 (2013.01); H01M 2/1094 (2013.01); H01M 2/22 (2013.01); H01M 10/0436 (2013.01); Y02E 60/13 (2013.01); H01G 11/22 (2013.01); H01M 10/045 (2013.01); H01M 10/0525 (2013.01); H01M 10/0583 (2013.01); H01M 10/425 (2013.01); H01G 11/82 (2013.01);
Abstract

[Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card. [Solution] In the electrochemical device RB, the main body of the package PA includes first cover plate, first terminal plate, frame plate, second terminal plate, and second cover platestacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates, by the through holesin the frame sectionsof the terminal platesand the through holein the frame plate


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