The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Jul. 25, 2012
Applicants:
Yousuke Endo, Kitaibaraki, JP;
Masaru Sakamoto, Kitaibaraki, JP;
Inventors:
Yousuke Endo, Kitaibaraki, JP;
Masaru Sakamoto, Kitaibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B23K 35/00 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); C23C 14/34 (2006.01); B23K 1/19 (2006.01);
U.S. Cl.
CPC ...
B23K 1/00 (2013.01); Y10T 428/12681 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C23C 14/3414 (2013.01); B23K 1/19 (2013.01);
Abstract
Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.