The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

May. 27, 2011
Applicants:

Hideo Harada, Kyoto, JP;

Kenta Nose, Kyoto, JP;

Masaru Honda, Kyoto, JP;

Eiji Iwawaki, Kyoto, JP;

Takahiro Tanaka, Kyoto, JP;

Inventors:

Hideo Harada, Kyoto, JP;

Kenta Nose, Kyoto, JP;

Masaru Honda, Kyoto, JP;

Eiji Iwawaki, Kyoto, JP;

Takahiro Tanaka, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 5/16 (2006.01); B05D 7/00 (2006.01); C08L 83/06 (2006.01); C08J 3/12 (2006.01); C08L 67/02 (2006.01); C08L 75/04 (2006.01); C08G 18/73 (2006.01); C08G 18/75 (2006.01); C08G 18/81 (2006.01); C08G 18/10 (2006.01); C08G 18/42 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); Y10T 428/2998 (2015.01); Y10T 428/2995 (2015.01); C08J 3/126 (2013.01); C08J 2300/00 (2013.01); C08J 2383/00 (2013.01); C08L 67/02 (2013.01); C08L 75/04 (2013.01); C08G 18/73 (2013.01); C08G 18/755 (2013.01); C08G 18/8175 (2013.01); C08G 18/10 (2013.01); C08G 18/4216 (2013.01); C08G 77/20 (2013.01);
Abstract

Disclosed is a resin particle having excellent low-temperature fusibility, having a sufficiently narrow size distribution, and that is obtained using a liquid or supercritical fluid. In the resin particle (C), which comprises a microparticle (A) containing a resin (a) being coated to or adhered to the surface of a resin particle (B) that contains another resin (b), the degree of swelling of the microparticle (A) resulting from liquid or supercritical carbon dioxide (X) at a temperature less than the glass transition temperature or the melting point of the microparticle (A) is no greater than 16%, and with the resin (a) as a constituent unit, the resin particle (C) contains 0.1-50 wt % of a non-crystalline non-halogen vinyl monomer (m1) of which the solubility parameter (SP value: (cal/cm)) is 7-9.


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