The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Feb. 24, 2012
Takehiko Goshima, Kunitachi, JP;
Takehiko Goshima, Kunitachi, JP;
Konica Minolta, Inc., Tokyo, JP;
Abstract
A method for producing a resin molding die () for molding a first substrate () having a flow path () and a through-hole (), wherein a base die () having a concave part () corresponding to the flow path () and a through-hole () corresponding to through-hole () and deeper than the concave part () is prepared, the base die () is subjected to electroforming with a first material and is then subjected to electroforming with a second material which is different from the first material, and a protruding part for forming through-hole () by removing the first material that was electrodeposited on through-hole () is formed. The first material has a smaller electroforming stress than the second material, the first material exerts a higher adhesiveness with regard to the base die than the second material, and the second material is harder than the first material.