The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Jul. 09, 2013
Applicant:

Sinoelectric Powertrain Corporation, Sunnyvale, CA (US);

Inventors:

Peng Zhou, El Cerrito, CA (US);

Paul Tsao, Los Altos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01); C23F 1/04 (2006.01); H05K 13/00 (2006.01); H01H 69/02 (2006.01); H01H 85/046 (2006.01); H01M 2/26 (2006.01); H01H 11/00 (2006.01); H01H 85/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 13/00 (2013.01); H01H 69/022 (2013.01); H01H 85/046 (2013.01); H01M 2/26 (2013.01); H01H 11/00 (2013.01); H01H 85/02 (2013.01); H01H 2085/025 (2013.01); H01M 2200/10 (2013.01); H05K 1/0293 (2013.01);
Abstract

Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding tabs. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer and connected to the current collector conductor pads and battery cell conductor pads, and one or more connections made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.


Find Patent Forward Citations

Loading…