The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Nov. 25, 2011
Applicants:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Inventors:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 7/12 (2006.01); C08L 75/16 (2006.01); C08G 18/67 (2006.01); C08G 18/75 (2006.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 2307/414 (2013.01); B32B 2310/0806 (2013.01); B32B 2457/20 (2013.01); B32B 2457/208 (2013.01); C08L 75/16 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2315/08 (2013.01); B32B 2333/04 (2013.01); C08G 18/672 (2013.01); C08G 18/755 (2013.01); B32B 17/10036 (2013.01); B32B 17/10706 (2013.01);
Abstract

Provided is a method of processing a translucent rigid substrate laminate, whereby it becomes possible to maintain peeling properties and good appearance of the translucent rigid substrate laminate during the processing of the translucent rigid substrate laminate even when a process such as transportation and storage is included in the method. The method of processing a translucent rigid substrate laminate comprises a step 1 for producing a translucent rigid substrate laminate in which at least two translucent rigid substrates are bonded to each other with a photocurable adhering agent; a step 2 for maintaining the translucent rigid substrate laminate, which has been produced in step 1 or which has been subjected to a shape processing subsequent to step 1, under predetermined temperature management conditions and transporting and/or storing the translucent rigid substrate laminate while maintaining the translucent rigid substrate laminate under the above-mentioned conditions; and a step 3 for peeling the translucent rigid substrate laminate which has been subjected to the shape processing or has not been subjected to the shape processing subsequent to step 2.


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