The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Nov. 08, 2013
Applicant:
Fanuc Corporation, Minamitsuru-gun, Yamanashi, JP;
Inventors:
Hajime Oono, Yamanashi, JP;
Mitsushi Yoshioka, Yamanashi, JP;
Assignee:
Fanuc Corporation, Yamanashi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/76 (2006.01); B29C 45/17 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1751 (2013.01);
Abstract
An injection molding machine is provided with an automatic mold thickness adjusting apparatus. The amount of compensation of the position of a rear platen that is adjusted at the time of installation of a mold is determined by calculating the thermal expansion of the mold that is expected to occur at the completion of a rise in temperature based on the difference in temperature between the mold temperature at the time of mold thickness adjustment and the mold temperature at the time of injection molding. Then, the rear platen is moved to the compensated position thus determined.