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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9022632 B1

PDFFull Text
Date of Patent:
May. 05, 2015

Filed:

Jul. 03, 2009

Led package and a backlight unit unit comprising said led package

Applicants:

Geun-young Kim, Seoul, KR;

Tomohisa Onishi, Suwon, KR;

Jung-hun Lee, Seoul, KR;

Young-taek Kim, Hwaseong, KR;

Jong-jin Park, Daejeon, KR;

Mi-jeong Yun, Daejeon, KR;

Young-sam Park, Seoul, KR;

Hun-joo Hahm, Seongnam, KR;

Hyung-suk Kim, Suwon, KR;

Seong-yeon Han, Gwangju, KR;

Do-hun Kim, Seoul, KR;

Dae-yeon Kim, Suwon, KR;

Dae-hyun Kim, Ulsan, KR;

Jung-kyu Park, Seoul, KR;

Inventors:

Geun-Young Kim, Seoul, KR;

Tomohisa Onishi, Suwon, KR;

Jung-Hun Lee, Seoul, KR;

Young-Taek Kim, Hwaseong, KR;

Jong-Jin Park, Daejeon, KR;

Mi-Jeong Yun, Daejeon, KR;

Young-Sam Park, Seoul, KR;

Hun-Joo Hahm, Seongnam, KR;

Hyung-Suk Kim, Suwon, KR;

Seong-Yeon Han, Gwangju, KR;

Do-Hun Kim, Seoul, KR;

Dae-Yeon Kim, Suwon, KR;

Dae-Hyun Kim, Ulsan, KR;

Jung-Kyu Park, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Ismael Negron

Assistant Examiner:

Erin Kryukova

Int. Cl.
CPC ...
G09F 13/04 (2006.01); G09F 13/08 (2006.01); F21V 7/04 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); F21V 8/00 (2006.01); G02F 1/1335 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
G02B 6/0023 (2013.01); G02F 1/133606 (2013.01); G02F 2001/133601 (2013.01); G02F 2001/133607 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

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