The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Aug. 07, 2008
Applicants:

Anthony Maglica, Ontario, CA (US);

Stacey H. West, Temecula, CA (US);

Robert P. Radloff, Corona, CA (US);

Inventors:

Anthony Maglica, Ontario, CA (US);

Stacey H. West, Temecula, CA (US);

Robert P. Radloff, Corona, CA (US);

Assignee:

Mag Instrument, Inc., Ontario, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21L 4/02 (2006.01); F21K 99/00 (2010.01); F21V 23/04 (2006.01); F21V 15/01 (2006.01); F21V 15/04 (2006.01); F21Y 101/02 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); F21V 23/00 (2006.01);
U.S. Cl.
CPC ...
F21L 4/027 (2013.01); F21K 9/00 (2013.01); F21V 15/04 (2013.01); F21V 23/04 (2013.01); F21V 29/004 (2013.01); F21Y 2101/02 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 3/429 (2013.01); H05K 2201/09309 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/10106 (2013.01); F21V 23/006 (2013.01); F21V 29/2206 (2013.01); F21V 29/246 (2013.01); F21V 15/011 (2013.01);
Abstract

A light emitting diode ('LED') module with improved thermal characteristics is provided. The module includes an LED, a first circuit board, a second circuit board, a lower insulator, an upper insulator, a lower contact, upper contacts, and a heat sink. Preferably, the heat sink comprises an outer housing and a contact ring. The LED and the heat sink are attached to the first circuit board via solder. In addition to serving as a substrate for the LED, the first circuit board (which contains a plurality of thermally conductive layers connected by vias) facilitates the transfer of heat away from the LED to the heat sink. The module also has improved mechanical and electrical properties, including redundant electrical connections, stable mechanical connections, and a shock-absorbing lower contact. The lower insulator can also be configured to prevent misalignment of the power source with the lower contact when the module is used in a flashlight or other lighting device.


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