The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Aug. 12, 2014
Seiko Epson Corporation, Tokyo, JP;
Shunsuke Watanabe, Matsumoto, JP;
Katsumi Enomoto, Koza-gun, JP;
Yasuo Inaoka, Shiojiri, JP;
Ryota Kinoshita, Matsumoto, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
A liquid ejecting head includes a head chip that ejects ink from a liquid ejecting surface. An inlet is disposed on the side opposite to the liquid ejecting surface. The liquid ejecting head includes an upstream flow path member, a downstream flow path member with an accommodating space that accommodates the head chip, a wiring member that is connected to a piezoelectric actuator in the head chip, and a wiring substrate. A first insertion hole, into which the wiring member is inserted, is disposed in the wiring substrate, a second insertion hole that is open to the accommodating space and the wiring substrate side for the wiring member to be inserted is formed in the downstream flow path member, and the wiring member is inserted into the first insertion hole and the second insertion hole to be bonded to the upstream flow path member side of the wiring substrate.