The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Aug. 07, 2007
Applicant:

Toru Fukano, Kyoto, JP;

Inventor:

Toru Fukano, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/15 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H01L 41/23 (2013.01); H01L 41/27 (2013.01); H03H 9/10 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); H03H 9/0576 (2013.01); H03H 9/14582 (2013.01); H05K 1/144 (2013.01); H05K 3/3426 (2013.01); H01L 41/23 (2013.01); H01L 41/27 (2013.01); H03H 9/059 (2013.01); H03H 9/1092 (2013.01);
Abstract

Provided is a method for manufacturing a surface acoustic wave apparatus that can reduce degradation of electric characteristics and also reduce the number of manufacturing processes. The method for manufacturing a surface acoustic wave apparatus includes the steps of: forming an IDT electrode on an upper surface of a piezoelectric substrate, forming a frame member surrounding a formation area in which the IDT electrode is formed on the piezoelectric substrate, and mounting a film-shaped lid member on the upper surface of the frame member so as to be joined to the frame member so that a protective cover, used for covering the formation area and for providing a tightly-closed space between it and the formation area, is formed.


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