The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Oct. 26, 2012
Hitachi Chemical Co., Ltd., Tokyo, JP;
Kazuya Sato, Ibaraki, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The present invention provides a circuit component that enables satisfactory connection between a substrate and an IC chip and a method of making the same. The circuit component includes an IC chip and a substrate connected to each other using an electrically conductive adhesive containing electrically conductive particles. Bump electrodes and a non-electrode surface are provided on a mounting surface of the IC chip. The non-electrode surface is a portion of the mounting surface other than a portion where the bump electrodes are formed. Electrically conductive particles are placed in a first state between the surfaces of the substrate and the non-electrode surface so as to be in contact with both surfaces. Electrically conductive particles are placed in a second state between the surfaces of both the substrate and the bump electrodes, so as to be more flattened than the first state and dig into the bump electrodes.