Surface acoustic wave transponder package for down-hole applications

Abstract

A method and apparatus for packaging surface acoustic wave transponders for use in down-hole or other extreme environmental applications is provided. An exemplary ID tag transponder may include a surface acoustic wave (SAW) piezoelectric device, wire bonds, antennae structure, an antenna reflector, a radome, and a base constructed of a conductive, non-magnetic metal or metal alloy adapted to withstand an extreme environment encountered in down-hole applications. The metallic base may have a notched lip or flange about its periphery that is adapted for pressure fitting into the milled cylindrical orifice located on the exterior surface of a tool asset. In some embodiments, an exemplary SAW piezoelectric device may be attached directly onto an antenna substrate and wire bonded directly to an antenna. An RF reflector is created inside an exemplary transponder tag device. A small amount of predetermined gas is held on top of the SAW piezoelectric device within the reflector cavity to accommodate acoustic wave propagation therein. Exemplary components of a transponder tag are enclosed and hermetically sealed within and between a radome top portion and the metallic base bottom portion.