The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Mar. 31, 2008
Applicants:

Julie E. Fouquet, Portola Valley, CA (US);

Gek Yong NG, Singapore, SG;

Richard Baumgartner, Palo Alto, CA (US);

Gary R. Trott, San Mateo, CA (US);

Inventors:

Julie E. Fouquet, Portola Valley, CA (US);

Gek Yong Ng, Singapore, SG;

Richard Baumgartner, Palo Alto, CA (US);

Gary R. Trott, San Mateo, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/06 (2006.01); H01F 27/30 (2006.01); H01F 27/28 (2006.01); H01F 19/08 (2006.01); H03F 3/45 (2006.01); H03H 7/52 (2006.01); H04L 25/02 (2006.01); H01F 17/00 (2006.01); H01F 27/40 (2006.01);
U.S. Cl.
CPC ...
H01F 19/08 (2013.01); H01F 27/2804 (2013.01); H03F 3/45192 (2013.01); H03F 3/45475 (2013.01); H03H 7/52 (2013.01); H04L 25/0266 (2013.01); H01F 17/0006 (2013.01); H01F 17/0013 (2013.01); H01F 27/40 (2013.01); H01F 2019/085 (2013.01); H03F 2203/45008 (2013.01); H03F 2203/45101 (2013.01); H03F 2203/45586 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/3011 (2013.01);
Abstract

Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.


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