The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Aug. 04, 2011
Applicants:
Takashi Sawada, Kyoto, JP;
Masao Saito, Kyoto, JP;
Inventors:
Takashi Sawada, Kyoto, JP;
Masao Saito, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 3/00 (2006.01); H03K 17/16 (2006.01); H03K 17/56 (2006.01); H02M 1/08 (2006.01); H02M 1/38 (2007.01); H02M 7/538 (2007.01); H03K 17/06 (2006.01); H01L 25/07 (2006.01); H01L 27/088 (2006.01); H01L 23/00 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/56 (2013.01); H01L 27/088 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H02M 1/08 (2013.01); H02M 1/38 (2013.01); H02M 7/538 (2013.01); H03K 17/063 (2013.01); H03K 2017/066 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49431 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85447 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/49111 (2013.01); H03K 17/06 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/45014 (2013.01); H02M 7/003 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A power module () includes a first high-side main-circuit MOSFET () and a second low-side main-circuit MOSFET () connected in series thereto. The series circuit of the MOSFETs () is connected in parallel to a power source (). A first short-circuit MOSFET () is connected between the gate and the source of the first main-circuit MOSFET (). A second short-circuit MOSFET () is connected between the gate and the source of the second main-circuit MOSFET ().