The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Mar. 07, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Sang Ki Chun, Daejeon, KR;

In Seok Hwang, Daejeon, KR;

Dong-Wook Lee, Daejeon, KR;

Ji Young Hwang, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); C08K 3/00 (2006.01); C08K 3/18 (2006.01); H01L 23/29 (2006.01); H01B 1/22 (2006.01); H01L 51/52 (2006.01); G02F 1/1335 (2006.01); C08K 5/17 (2006.01); C08K 3/22 (2006.01); C08K 3/30 (2006.01); C08L 83/04 (2006.01); C08K 5/3445 (2006.01); C08K 5/43 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08K 3/0066 (2013.01); C08K 5/17 (2013.01); C08K 2003/2203 (2013.01); C08K 3/18 (2013.01); C08K 3/30 (2013.01); C08L 83/04 (2013.01); H01L 23/29 (2013.01); C08K 5/3445 (2013.01); C08K 2201/001 (2013.01); H01B 1/22 (2013.01); H01L 51/5253 (2013.01); C08K 5/43 (2013.01); G02F 1/1336 (2013.01);
Abstract

An encapsulating composition for a light emitting element, a light emitting diode (LED) and a liquid crystal display device (LCD) are provided. A silicone-cured product included as a main ingredient and a conductivity-providing agent having excellent compatibility and capable of providing superior conductivity can be used to significantly reduce the surface resistivity of the silicone-cured product. Therefore, the encapsulating composition for a light emitting element, the LED and the LCD can be useful in solving the problems regarding attachment of a foreign substance such as dust due to static electricity, and degradation of transparency since the composition has low surface resistivity when used as a semiconductor encapsulation material for an LED, and also in providing a cured product having excellent properties such as light resistance, heat resistance, durability and optical transparency.


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