The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Apr. 03, 2012
Applicants:

Crocifisso Marco Antonio Renna, Gela, IT;

Antonino Scuderi, Misterbianco, IT;

Carlo Magro, San Giovanni la Punta, IT;

Nunzio Spina, Catania, IT;

Egidio Ragonese, Aci Catena, IT;

Barbaro Marano, Acireale, IT;

Giuseppe Palmisano, S. Giovanni la Punta, IT;

Inventors:

Crocifisso Marco Antonio Renna, Gela, IT;

Antonino Scuderi, Misterbianco, IT;

Carlo Magro, San Giovanni la Punta, IT;

Nunzio Spina, Catania, IT;

Egidio Ragonese, Aci Catena, IT;

Barbaro Marano, Acireale, IT;

Giuseppe Palmisano, S. Giovanni la Punta, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2225/06531 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/1305 (2013.01);
Abstract

A galvanic-isolated coupling of circuit portions is accomplished on the basis of a stacked chip configuration. The semiconductor chips thus can be fabricated on the basis of any appropriate process technology, thereby incorporating one or more coupling elements, such as primary or secondary coils of a micro transformer, wherein the final characteristics of the micro transformer are adjusted during the wafer bond process.


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