The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Sep. 20, 2011
Applicants:

Richard L. Knipe, McKinney, TX (US);

Robertus Petrus Van Kampen, S-Hertogenbosch, NL;

Anartz Unamuno, Roermond, NL;

Roberto Gaddi, S-Hertogenbosch, NL;

Inventors:

Richard L. Knipe, McKinney, TX (US);

Robertus Petrus van Kampen, S-Hertogenbosch, NL;

Anartz Unamuno, Roermond, NL;

Roberto Gaddi, S-Hertogenbosch, NL;

Assignee:

Cavendish Kinetics, Ltd., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/02 (2006.01); H01H 1/00 (2006.01); H01H 59/00 (2006.01);
U.S. Cl.
CPC ...
H01H 1/0036 (2013.01); H01H 59/0009 (2013.01); H01H 2001/0084 (2013.01);
Abstract

The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.


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