The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Apr. 25, 2012
Applicants:

Masutsugu Tasaki, Saitama, JP;

Akira Ichikawa, Saitama, JP;

Hideaki Sato, Saitama, JP;

Satoshi Endo, Saitama, JP;

Takayuki Motoyanagi, Saitama, JP;

Yoshihiro Okabe, Saitama, JP;

Yoichi Orikasa, Saitama, JP;

Masaru Azuma, Saitama, JP;

Inventors:

Masutsugu Tasaki, Saitama, JP;

Akira Ichikawa, Saitama, JP;

Hideaki Sato, Saitama, JP;

Satoshi Endo, Saitama, JP;

Takayuki Motoyanagi, Saitama, JP;

Yoshihiro Okabe, Saitama, JP;

Yoichi Orikasa, Saitama, JP;

Masaru Azuma, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 33/58 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/58 (2013.01); H01L 2933/005 (2013.01); H01L 2924/0002 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.


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