The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Jun. 22, 2012
Applicants:

Kuo-ming Chiu, New Taipei, TW;

Tsung-chi Lee, New Taipei, TW;

Chia-hao Wu, Taipei, TW;

Meng-sung Chou, New Taipei, TW;

Inventors:

Kuo-Ming Chiu, New Taipei, TW;

Tsung-Chi Lee, New Taipei, TW;

Chia-Hao Wu, Taipei, TW;

Meng-Sung Chou, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/60 (2013.01); H01L 33/642 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.


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