The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

May. 08, 2013
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Jun Ishii, Osaka, JP;

Saori Kanezaki, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 1/05 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 3/42 (2013.01); H05K 1/053 (2013.01); H05K 1/111 (2013.01); H05K 3/321 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10083 (2013.01);
Abstract

A wired circuit board includes an insulating layer to be formed with an opening extending therethrough in a thickness direction of the wired circuit board, a conductive layer formed on one surface of the insulating layer in the thickness direction and including a one-side terminal portion, an other-side terminal portion formed on the other surface of the insulating layer in the thickness direction, disposed so as to overlap the opening and the one-side terminal portion when projected in the thickness direction, and used to be connected to an electronic element via a conductive adhesive, and a conductive portion filling the opening to provide electrical conduction between the one-side terminal portion and the other-side terminal portion.


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