The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Mar. 17, 2011
Applicants:
Lung-chang Liu, XinZhuang, TW;
Ming-hua Chung, Tainan, TW;
Jen-hao Chen, Hsinchu, TW;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/50 (2006.01); C08F 220/06 (2006.01); C08F 220/18 (2006.01); C08F 220/26 (2006.01); C08F 220/36 (2006.01); C08F 230/08 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/038 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
C08F 2/50 (2013.01); C08F 220/06 (2013.01); C08F 220/18 (2013.01); C08F 220/26 (2013.01); C08F 220/36 (2013.01); C08F 230/08 (2013.01); G03F 7/0047 (2013.01); G03F 7/027 (2013.01); G03F 7/038 (2013.01); G03F 7/0755 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
An encapsulant composition is provided, including at least one resin monomer, a filler and a photoinitiator, wherein the at least one resin monomer is selected from the group consisting of acrylic resin monomer, epoxy resin monomer, silicone resin monomer and compositions thereof, and the filler is of about 0.1˜15 weight % of the encapsulant composition. A method for forming encapsulant materials is also provided.