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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9018042 B1

PDFFull Text
Expired
Date of Patent:
Apr. 28, 2015

Filed:

Nov. 26, 2013

Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hidekazu Arase, Hyogo, JP;

Tomoyuki Komori, Osaka, JP;

Assignee:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Charles Garber

Assistant Examiner:

Stanetta Isaac

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 23/3114 (2013.01); H01L 21/56 (2013.01); H01L 21/6836 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 23/3171 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95085 (2013.01); H01L 2224/951 (2013.01); H01L 2224/95143 (2013.01);
Abstract

In order to provide a novel method for producing a chip having a water-repellent obverse surface and a hydrophilic reverse surface, the characteristic of the present disclosure lies in that the obverse surface of the chip having a hydroxyl group is brought into contact with an organic solvent in which R—Si(OR)or R—SiYis dissolved in a second hydrophobic solvent, while the reverse surface of the chip is protected by the water film, so as to form a water-repellent film on the obverse surface of the chip.

Find Patent Forward Citations

Arase, Hidekazu. (2015). Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface (U.S. Patent No. 9018042). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9018042

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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