The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Aug. 01, 2012
Applicants:

Yoshimitsu Oda, Suita, JP;

Masaaki Ishio, Tokyo, JP;

Inventors:

Yoshimitsu Oda, Suita, JP;

Masaaki Ishio, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/30 (2006.01); H01M 2/02 (2006.01); H01M 2/06 (2006.01); H01M 2/20 (2006.01); H01M 2/26 (2006.01);
U.S. Cl.
CPC ...
H01M 2/30 (2013.01); H01M 2/024 (2013.01); H01M 2/06 (2013.01); H01M 2/206 (2013.01); H01M 2/263 (2013.01); H01M 2/305 (2013.01);
Abstract

A negative-electrode terminal for a cell in which separation between a first metal layer and a second metal layer hardly takes place is provided by suppressing excess formation of an intermetallic compound on a bond interface between the first metal layer and the second metal layer. This negative-electrode terminal for a cell includes a clad portion formed by bonding a first metal layer made of Al or an Al alloy and a second metal layer containing Ni and Cu and consisting of one or a plurality of layers to each other. The first metal layer includes a connected region connected with a cell terminal connecting plate and a stacked region adjacent to the connected region on the side of the same surface, while the second metal layer is bonded to the first metal layer in the stacked region and configured to be connectable to cell negative electrodes of cells.


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