The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Mar. 05, 2012
Applicants:

Richard H. Wykoff, Commerce Township, MI (US);

Daniel Q. Houston, Dearborn, MI (US);

Inventors:

Richard H. Wykoff, Commerce Township, MI (US);

Daniel Q. Houston, Dearborn, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B29C 43/36 (2006.01); B32B 3/30 (2006.01); B29C 65/48 (2006.01); B29C 43/02 (2006.01); B29K 103/04 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/36 (2013.01); Y10T 428/24355 (2015.01); Y10T 156/1043 (2015.01); Y10T 156/1002 (2015.01); B32B 3/00 (2013.01); B32B 3/30 (2013.01); B29C 43/021 (2013.01); B29K 2103/04 (2013.01); B29C 65/483 (2013.01); B29C 66/02245 (2013.01); B29C 66/028 (2013.01); B29C 66/1312 (2013.01); B29C 66/7212 (2013.01); B29C 66/72143 (2013.01); B29C 66/723 (2013.01); B29C 66/73161 (2013.01); B29C 66/542 (2013.01);
Abstract

An automotive assembly comprises a sheet molding composite (SMC) element comprising an SMC sheet body shaped into a generally smooth functional section and at least one generally planar bonding section. The bonding section comprises a textured surface impressed as a result of molding the SMC sheet body in a compression molding tool having a corresponding textured pattern. The textured surface has a predetermined surface roughness for increasing the effective surface area of the bonding section relative to a non-textured surface. The predetermined surface roughness is in a range from 0.25 R(μm) to 8.5 R(μm). A second element has a secondary bonding surface adjoining the bonding section of the SMC element. An adhesive joins the secondary bonding surface to the bonding section without requiring any pre-treatment of the bonding section.


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