The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Jun. 01, 2012
Teruo Shimizu, Tokyo, JP;
Tsuneo Maruyama, Niigata, JP;
Teruo Shimizu, Tokyo, JP;
Tsuneo Maruyama, Niigata, JP;
Diamet Corporation, Niigata-Shi, JP;
Abstract
There is provided a sliding part in which a surface coverage ratio of copper in the sliding part increases. A bearing which is the sliding part is formed by filling the raw powder into the filling portion of the forming mold, compacting the raw powder to form a powder compact, which is sintered. A copper-based raw powder is composed of a copper-based flat raw powder whose diameter is smaller than that of an iron-based raw powder and an aspect ratio larger than that of the iron-based raw powder, and a copper-based small-sized raw powder whose diameter is smaller than that of the copper-based flat raw powder. The copper is allowed to segregate at the surface of the sliding part. The surface of the bearing is covered with the copper-based small-sized raw powder and the copper-based flat raw powder, thereby the surface coverage ratio of copper can be increased.