The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Mar. 24, 2014
Taisei Plas Co., Ltd., Tokyo, JP;
Masanori Naritomi, Tokyo, JP;
Naoki Andoh, Tokyo, JP;
Taisei Plas Co., Ltd., Tokyo, JP;
Abstract
A method for preparing a copper alloy given a certain special surface shape yields tremendous bonding strength through compatibility with an epoxy resin adhesive. With a composite part in which this technology is utilized to integrate a copper alloy member as a cover material with a CFRP, it is possible to take advantage of the characteristics of both the copper alloy and the FRP due to the tremendous bonding strength. In a step in which an FRP prepreg is put into a mold and heated and cured, usually the mold is first coated with a release agent to facilitate release from the mold, but with high-technology CFRP, bleeding of the release agent often diminishes the properties. A copper alloy sheetis used as a cover material, and a CFRPis cured.