The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Mar. 19, 2010
Applicants:

Yoshinori Nagamine, Tama, JP;

Kanto Nakamura, Hopkins, MN (US);

Koji Tsunekawa, Tokyo, JP;

Inventors:

Yoshinori Nagamine, Tama, JP;

Kanto Nakamura, Hopkins, MN (US);

Koji Tsunekawa, Tokyo, JP;

Assignee:

Canon Anelva Corporation, Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C25B 9/00 (2006.01); C25B 11/00 (2006.01); C25B 13/00 (2006.01); C23C 16/00 (2006.01); C23C 14/50 (2006.01); C23C 16/458 (2006.01); C23C 14/35 (2006.01); H01J 37/34 (2006.01); C23C 14/08 (2006.01); C23C 14/22 (2006.01); C23C 14/34 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
C23C 14/50 (2013.01); C23C 16/4586 (2013.01); C23C 14/352 (2013.01); H01J 37/3417 (2013.01); H01J 37/3438 (2013.01); H01J 37/3444 (2013.01); C23C 14/081 (2013.01); C23C 14/225 (2013.01); C23C 14/345 (2013.01); C23C 14/3464 (2013.01); H01L 43/12 (2013.01);
Abstract

Provided is a high-quality magnetoresistive thin film by using a method of controlling self bias of a high-frequency sputtering device. In order to control the self bias for the substrate by adjusting a substrate potential, the high-frequency sputtering device according to the present invention includes: a chamber; evacuation means for evacuating the inside of the chamber; gas introduction means for supplying a gas into the chamber; a substrate holder provided with a substrate mounting table; rotation drive means capable of rotating the substrate holder; a sputtering cathode provided with a target mounting table and arranged such that the surface of the target mounting table is non-parallel to the surface of the substrate mounting table; an electrode disposed inside the substrate holder; and a variable impedance mechanism electrically connected to the electrode, for adjusting the substrate potential on the substrate holder.


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