The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Feb. 15, 2011
Applicants:

David P. Miess, Highland, UT (US);

Michael A. Vail, Genola, UT (US);

Kenneth E. Bertagnolli, Riverton, UT (US);

C. Eugene Mcmurray, Payson, UT (US);

Paul Douglas Jones, Elk Ridge, UT (US);

Inventors:

David P. Miess, Highland, UT (US);

Michael A. Vail, Genola, UT (US);

Kenneth E. Bertagnolli, Riverton, UT (US);

C. Eugene McMurray, Payson, UT (US);

Paul Douglas Jones, Elk Ridge, UT (US);

Assignee:

US Synthetic Corporation, Orem, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 18/00 (2006.01); B24D 99/00 (2010.01); B24D 3/02 (2006.01);
U.S. Cl.
CPC ...
B24D 3/02 (2013.01);
Abstract

Embodiments of the invention relate to polycrystalline diamond compacts ('PDCs') comprising a polycrystalline diamond ('PCD') table including a thermally-stable region having at least one low-carbon-solubility material disposed interstitially between bonded diamond grains thereof, and methods of fabricating such PDCs. In an embodiment, a PDC includes a substrate, and a PCD table bonded to the substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween and defining a plurality of interstitial regions. The PCD table further includes at least one low-carbon-solubility material disposed in at least a portion of the plurality of interstitial regions. The at least one low-carbon-solubility material exhibits a melting temperature of about 1300° C. or less and a bulk modulus at 20° C. of less than about 150 GPa.


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