The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Aug. 25, 2011
Teemu Karhu, Lahti, FI;
Timo Myllys, Lahti, FI;
Olav Pirttiniemi, Järvelä, FI;
Aimo Ojava, Lahti, FI;
Päivi Määttä, Lappila, FI;
Jalliina Järvinen, Lahti, FI;
Teemu Karhu, Lahti, FI;
Timo Myllys, Lahti, FI;
Olav Pirttiniemi, Järvelä, FI;
Aimo Ojava, Lahti, FI;
Päivi Määttä, Lappila, FI;
Jalliina Järvinen, Lahti, FI;
Stora Enso OYJ, Helsinki, FI;
Abstract
The present invention relates to a method for forming a package by moulding a cardboard blank in such a manner that a margin area () of the blank, surrounding a middle portion () of the blank, is bent upwards to form side walls of the package while the middle portion forms a bottom of the package. The cardboard blank prior to moulding is provided with at least one area () of reduced bending stiffness being located in a transition zone () between the side walls and the bottom. The package is moulded from the blank so that the at least one area () of reduced bending stiffness is located in the bended areas between the side walls and the bottom and extend in the running direction of the bend. The invention further relates to a package and a package blank that can be used for forming said package.