The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Mar. 15, 2013
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Bradley J. Ver Meer, Savage, MN (US);

Ravishankar Ajjanagadde Shivarama, Eden Prairie, MN (US);

Assignee:

Seagate Technology LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 11/00 (2006.01); G11B 5/48 (2006.01); G11B 5/60 (2006.01); G11B 13/04 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
G11B 13/04 (2013.01); G11B 5/486 (2013.01); G11B 2005/0021 (2013.01); G11B 5/6088 (2013.01);
Abstract

A flex circuit including a dual sided interconnect structure to connect electrical components on a head or suspension assembly to head circuitry is described. The dual sided interconnect structure described has application for providing an electrical connection to one or more transducer elements on a slider and one or more elements of a heat assisted magnetic recording HAMR unit. In an illustrated embodiment, a flexible structure or insulating base layer includes one or more slider and heat assisted magnetic recording traces coupled to one or more slider or HAMR bond pads on an interconnect portion. As disclosed, the slider bond pads are on the obverse side of the flexible structure and the HAMR bond pads include a reverse side bonding surface to form reverse side bond pads to connect to one or more electrical or heating elements on the HAMR unit.


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