The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Jan. 11, 2012
Applicants:
Udo Ausserlechner, Villach, AT;
Carsten Von Koblinski, Bodensdorf, AT;
Sigrid Wabnig, Villach, AT;
Volker Strutz, Tegernheim, DE;
Robert Grünberger, Nandlstadt, DE;
Inventors:
Udo Ausserlechner, Villach, AT;
Carsten von Koblinski, Bodensdorf, AT;
Sigrid Wabnig, Villach, AT;
Volker Strutz, Tegernheim, DE;
Robert Grünberger, Nandlstadt, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); G01R 15/20 (2006.01); G01R 33/07 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01R 15/20 (2013.01); G01R 33/072 (2013.01); H01L 23/16 (2013.01); H01L 23/3107 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49177 (2013.01); H01L 2924/15153 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01087 (2013.01); H01L 2224/32257 (2013.01); H01L 2924/3011 (2013.01);
Abstract
In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.