The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Mar. 12, 2013
Applicants:

Inventec (Pudong) Technology Corporation, Shanghai, CN;

Inventec Corporation, Taipei, TW;

Inventors:

Yi-Lun Cheng, Taipei, TW;

Ming-Hung Lin, Taipei, TW;

Chun-Lung Lin, Taipei, TW;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01);
Abstract

An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation.


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