The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Feb. 04, 2011
Masahito Saruban, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Syunsuke Takeuchi, Nagaokakyo, JP;
Kiyoyasu Sakurada, Nagaokakyo, JP;
Masahito Saruban, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Syunsuke Takeuchi, Nagaokakyo, JP;
Kiyoyasu Sakurada, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.