The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Oct. 17, 2013
Applicants:
Makoto Imai, Toyota, JP;
Toru Tanaka, Nagoya, JP;
Inventors:
Makoto Imai, Toyota, JP;
Toru Tanaka, Nagoya, JP;
Assignee:
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01L 24/33 (2013.01); H01L 23/3135 (2013.01); H01L 23/315 (2013.01); H01L 23/49562 (2013.01); H01L 23/3107 (2013.01);
Abstract
A semiconductor device includes a semiconductor element, a capacitor, a first resin, lead frames and a second resin. The first resin forms a resin molding which covers the semiconductor element and the capacitor. The lead frames are attached to two surfaces of the resin molding and are connected to the semiconductor element and the capacitor. The second resin directly covers the capacitor and has a rigidity lower than a rigidity of the first resin. An outside of the second resin is directly covered with the first resin.