The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Jan. 10, 2011
Applicant:
Michael Doelle, Munich, DE;
Inventor:
Michael Doelle, Munich, DE;
Assignee:
ELMOS Semiconductor AG, Dortmund, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); G01L 19/04 (2006.01); G01L 9/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/0018 (2013.01); B81B 3/0021 (2013.01); B81B 3/007 (2013.01); B81B 3/0072 (2013.01); B81B 3/0081 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81C 1/00626 (2013.01); B81C 2201/019 (2013.01); G01L 9/0047 (2013.01);
Abstract
A micro-electromechanical semiconductor component is provided with a semiconductor substrate, a reversibly deformable bending element made of semiconductor material, and at least one transistor that is sensitive to mechanical stresses. The transistor is designed as an integrated component in the bending element.