The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Nov. 18, 2011
Applicants:

Qingqing Liang, Lagrangeville, NY (US);

Miao Xu, Beijing, CN;

Huilong Zhu, Poughkeepsie, NY (US);

Huicai Zhong, San Jose, CA (US);

Inventors:

Qingqing Liang, Lagrangeville, NY (US);

Miao Xu, Beijing, CN;

Huilong Zhu, Poughkeepsie, NY (US);

Huicai Zhong, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/786 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78654 (2013.01); H01L 29/4908 (2013.01); H01L 29/78603 (2013.01); H01L 29/78648 (2013.01); H01L 29/78696 (2013.01);
Abstract

The present application discloses a semiconductor device comprising a source region and a drain region in an ultra-thin semiconductor layer; a channel region between the source region and the drain region in the ultra-thin semiconductor layer; a front gate stack above the channel region, the front gate comprising a front gate and a front gate dielectric between the front gate and the channel region; and a back gate stack below the channel region, the back gate stack comprising a back gate and a back gate dielectric between the back gate and the channel region, wherein the front gate is made of a high-Vt material, and the back gate is made of a low-Vt material. According to another embodiment, the front gate and the back gate are made of the same material, and the back gate is applied with a forward bias voltage during operation. The semiconductor device alleviates threshold voltage fluctuation due to varied thickness of the channel region by means of the back gate.


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