The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2015
Filed:
Sep. 25, 2012
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Cristiano Gianluca Stella, San Gregorio Di Catania, IT;
Rosalba Cacciola, Tremestrieri Etneo, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza (MB), IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/34 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3468 (2013.01); H05K 1/111 (2013.01); H05K 3/305 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09472 (2013.01); H05K 2201/09745 (2013.01); H05K 2203/044 (2013.01); H01L 2224/73203 (2013.01);
Abstract
An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.